- Published: Tuesday, August 25, 2020 12:13
By Naidu Annamaneni
In 2017 eSilicon, a semiconductor design and manufacturer specializing in making chips tailored to its customer’s specific requirements, faced an enormous challenge. The company was being held back by the inherent limitations of the “datacenter as a service” solution that it had been using to run its High-Performance Computing (HPC) chip design workloads. However, the public cloud providers had not yet addressed the many technical challenges of doing this work—which included thousands of cores and peta bytes of storage—in the cloud.
As eSilicon’s CIO and Vice President of Global IT at the time, I led the team that partnered with Google and several other companies to address this challenge and become the first semiconductor maker to do end-to-end design in the cloud. Along the way I learned quite a bit about how to successfully and cost-effectively run HPC in the cloud.